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NEXTFLEX CONVENES THE HYBRID ELECTRONICS COMMUNITY AT BINGHAMTON UNIVERSITY TO FOCUS ON PACKAGING OPPORTUNITIES IN MEDICAL AND INDUSTRIAL APPLICATIONS
Binghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking. Seventy-five attendees from industry, academia, and government convened to provide presentations in two technical sessions.

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Photo by: NextFlex |  VIRIN: 240429-D-D5021-1002.PNG